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1

In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors

Yong, Woon Yik, Zhang, Xiaowu, Chai, Tai Chong, Trigg, Alastair, Jaafar, Norhanani Binte, Lo, Guo-Qiang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 2.38 MB

english, 2013

2

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Design and development of micro-sensors for measuring localised stresses during copper wirebonding

Xiaowu Zhang,, Selvanayagam, C. S., Woon Yik Yong,, Chai, T. C., Trigg, A. D.

Year:

2012

Language:

english

File:

PDF, 1.09 MB

english, 2012

3

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Process and reliability assessment of 200μm-thin embedded wafer level packages (EMWLPs)

Kim, Hyoung Joon, Chong, Ser Choong, Ho, David Soon Wee, Yong, Eric Woon Yik, Khong, Chee Houe, Teo, Calvin Wei Liang, Fernandez, Daniel Moses, Lau, Guan Kian, Vasarla, Nagendra Sekhar, Lee, Vincent W

Year:

2011

Language:

english

File:

PDF, 1.73 MB

english, 2011

4

Thermal Assessment of Dynamic Rotor/Auxiliary Bearing Contact Events

Keogh, Patrick S., Yong, Woon Yik

Journal:

Journal of Tribology

Year:

2007

Language:

english

File:

PDF, 235 KB

english, 2007

5

Annular Component Transient Thermoelastic Analysis Using a State Space Approach

Yong, Woon Yik, Keogh, Patrick S.

Journal:

Journal of Tribology

Year:

2007

Language:

english

File:

PDF, 771 KB

english, 2007

6

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Forced-time controlled transient dynamic wire bonding simulation for wire bond process development

Meng, Chai Chee, Yik, Eric Yong Woon

Year:

2015

Language:

english

File:

PDF, 585 KB

english, 2015

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